It dictates exactly how to translate a component’s physical dimensions—found in the component datasheet—into the copper pads on your PCB.
: It is worth noting that IPC-7352 is intended as the eventual replacement for the 7351 series. Altium Resources provides a comparison of these standards for BGA and land pattern creation. Major Changes in the "C" Revision
Even with the standard in hand, engineers make errors:
Engineers, designers, and manufacturers rely on the IPC-7351C PDF standard to ensure that their products meet the necessary requirements for quality, reliability, and performance. You can obtain a copy of the IPC-7351C PDF document directly from the IPC website or through industry distributors.
The is the draft and eventual successor to the "B" revision of the Generic Requirements for Surface Mount Design and Land Pattern Standards . It is the go-to reference for PCB designers creating footprints that ensure reliable solder joints and manufacturability. Key Updates in IPC-7351C
: This document on Scribd highlights specific updates, such as the shift toward proportional pad stacks for annular rings and the recommendation of rounded rectangle pads instead of oblong shapes.